The simulation of fire scenarios is usually much cheaper than experiments. We perform these simulations to assess the risk of failure for strucures when exposed to fire hazards. We also help to design strategies for the prevention or controlled delay of strucural failure under fire.

Modern semiconductor power package design encompasses processes such as die attachment, glob top and molding. They involve liquids in various forms with phase change, surface tension, thixotropy and many other characteristics. We optimize package components (such as clip and leadframe) and solder depots to reduce void concentration and to improve overall package performance.

With the increasing demands towards electronics equipment, energy density is also increasing. To prevent overheating and system failure, the control of power dissipation is receiving more importance. We design strategies for liquid cooling, heat pipes, vapor chambers and fin coolers to deliver superior low noise performance for your product.

Fans and blowers are widely used in the industry for cooling applications. The important design criteria are efficiency and low noise.  We have developed numerous patents focusing on winglets, tripping, blade loading and other strategies to reach rhese goals.